Paper Title:
Microstructural Analysis for Si Wafer after CMG Process
  Abstract

The single crystal of Si is still one of the most important candidates among other materials including Single crystals of SiC, GaN, C(diamond) or compound semiconductors. The innovative process as called CMG(Chemo-Mechanical-Grinding) for Si wafer has been recently developed which is different from conventional CMP(Chemo-Mechanical-Polishing ) process. The CMG process can be done under dry conditions using CeO2 based solid bulk abrasives. The microstructures for surface and subsurface of Si single crystal after CMG process were analyzed using TEM/EDX, AFM, MFP-3D Microscope. The mechanism of CMG process was also investigated by X-ray diffraction and ICP chemical analysis using products by chemical reaction between Si and CeO2 abrasives. The results showed that Si single crystal after CMG had, 1) no defects even Si lattice revel or mechanical imperfections,2) better surface roughness as compared to CMP process. The CMG mechanism concluded that CeO2 reacted with Si producing Ce-Si-O amorphous phase.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
367-372
DOI
10.4028/www.scientific.net/KEM.329.367
Citation
S. Kamiya, H. Iwase, T. Nagaike, L. B. Zhou, H. Eda, S. Kimura, "Microstructural Analysis for Si Wafer after CMG Process", Key Engineering Materials, Vol. 329, pp. 367-372, 2007
Online since
January 2007
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$32.00
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