Paper Title:
Experimental and Simulation Research on Influence of Temperature on Nano-Scratching Process of Silicon Wafer
  Abstract

This study aims to clarify the interaction between Si wafer and individual diamond abrasives in grinding at nanometer level and to estimate the grinding conditions for minimizing the surface defect. This paper reports on the results obtained through nano-scratching experiments in vacuum by an atomic force microscope (AFM) and simulations by using the molecular dynamics method by applying Tersoff potential for Si-Si atomic interaction under room and high temperature, respectively, to examine the influence of the grinding heat on the materials removal process. As a result, it was proven that the scratch groove under high temperature becomes deeper than that under room temperature from the experiments, and it was also observed that the formation of the amorphous phase around the scratch groove under high temperature becomes a little bit larger than that under room temperature from the simulations.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
379-384
DOI
10.4028/www.scientific.net/KEM.329.379
Citation
H. Okabe, T. Tsumura, J. Shimizu, L. B. Zhou, H. Eda, "Experimental and Simulation Research on Influence of Temperature on Nano-Scratching Process of Silicon Wafer", Key Engineering Materials, Vol. 329, pp. 379-384, 2007
Online since
January 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yong Da Yan, Tao Sun, Shen Dong, Ying Chun Liang
Abstract:A three dimensional molecular dynamics model is employed to simulate AFM-based lithography process. To investigate effects of tip geometry,...
228
Authors: Jia Xuan Chen, Ying Chun Liang, Qing Shun Bai, Yu Lan Tang, Ming Jun Chen
Abstract:Molecular dynamics (MD) simulations of nanometric scratching with diamond tip are conducted on single crystal copper crystal plane (010),...
6
Authors: Jun Shimizu, Li Bo Zhou, Takeyuki Yamamoto
Abstract:This paper reports a molecular dynamics simulation of chemo-mechanical grinding (CMG) of silicon wafer by controlling the interatomic...
82
Authors: Jun Shimizu, Li Bo Zhou, Takeyuki Yamamoto, Han Huang
Abstract:This study aims to clarify the friction and wear phenomena, which are of great importance in abrasive machining with atomic-scale material...
417
Authors: M. Rizwan Malik, Tie Lin Shi, Zi Rong Tang, Ping Peng
Abstract:A growing scientific effort is being devoted to the study of nanoscale interface aspects such as thin-film adhesion, abrasive wear and...
107