A New Complex Grinding Method for Ceramic Materials Combined with Ultrasonic Vibration and Electrodischarge Machining |
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| Journal | Key Engineering Materials (Volume 329) |
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| Volume | Advances in Abrasive Technology IX |
| Edited by | Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki |
| Pages | 439-444 |
| DOI | 10.4028/www.scientific.net/KEM.329.439 |
| Citation | Kiyoshi Suzuki et al., 2007, Key Engineering Materials, 329, 439 |
| Online since | January, 2007 |
| Authors | Kiyoshi Suzuki, Tetsutaro Uematsu, Manabu Iwai, Shinichi Ninomiya, Sadao Sano, Takeo Nakagawa |
| Keywords | Ceramic Materials, Machining Center, Metal-Bonded Grinding Wheel, Ultrasonic Electrodischarging Grinding Method |
| Abstract | A new complex grinding method named Ultrasonic Electrodischarging Grinding Method (US-ED-G in short) is described. In the US-ED-G, ultrasonic grinding and ED grinding are simultaneously carried out on an electrically conductive workpiece with a metal bond grinding wheel. When compared with other complex grinding methods, the US-ED-G is remarkably effective in reducing grinding force a great deal and maintaining grinding ability of a wheel for a long time in efficient grinding of extremely hard-to-grind ceramic materials like TiB2. A stock removal rate of 200mm3/min and a grinding ratio of 110 have been attained by selecting appropriate conditions in US-ED-G of TiB2. A compact and rigid ultrasonic attachment is also described, which was developed as a removable tool for carrying out US grinding and US-ED-grinding on a machining center or a grinding center. |
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