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A New Complex Grinding Method for Ceramic Materials Combined with Ultrasonic Vibration and Electrodischarge Machining

Journal Key Engineering Materials (Volume 329)
Volume Advances in Abrasive Technology IX
Edited by Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages 439-444
DOI 10.4028/www.scientific.net/KEM.329.439
Citation Kiyoshi Suzuki et al., 2007, Key Engineering Materials, 329, 439
Online since January, 2007
Authors Kiyoshi Suzuki, Tetsutaro Uematsu, Manabu Iwai, Shinichi Ninomiya, Sadao Sano, Takeo Nakagawa
Keywords Ceramic Materials, Machining Center, Metal-Bonded Grinding Wheel, Ultrasonic Electrodischarging Grinding Method
Abstract

A new complex grinding method named Ultrasonic Electrodischarging Grinding Method (US-ED-G in short) is described. In the US-ED-G, ultrasonic grinding and ED grinding are simultaneously carried out on an electrically conductive workpiece with a metal bond grinding wheel. When compared with other complex grinding methods, the US-ED-G is remarkably effective in reducing grinding force a great deal and maintaining grinding ability of a wheel for a long time in efficient grinding of extremely hard-to-grind ceramic materials like TiB2. A stock removal rate of 200mm3/min and a grinding ratio of 110 have been attained by selecting appropriate conditions in US-ED-G of TiB2. A compact and rigid ultrasonic attachment is also described, which was developed as a removable tool for carrying out US grinding and US-ED-grinding on a machining center or a grinding center.

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