Paper Title:
A Micro Ultrasonic Grinding Device with Very High Frequency and its Application
  Abstract

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Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
45-50
DOI
10.4028/www.scientific.net/KEM.329.45
Citation
K. Suzuki, S. Mishiro, Y. Shishido, M. Iwai, W. Mei, T. Uematsu, "A Micro Ultrasonic Grinding Device with Very High Frequency and its Application", Key Engineering Materials, Vol. 329, pp. 45-50, 2007
Online since
January 2007
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