Paper Title:
Quantitative Adhesion Measures of Diamond Films Using A Blister Test
  Abstract

Adhesion properties of diamond thin films are essential to their performance in technical applications. To obtain the adhesive strength precisely and quantitatively has been the frontier issue to the related scientists and engineers. In this paper, a new experimental equipment for blister tests was designed purposely and fabricated considering related influencing facts. A free-standing window of diamond thin film with the support of silicon wafer was obtained by the aid of photolithography and anisotropic wet etching technology so as to improve the precision of quantitative adhesion measures of diamond films. The mechanics for calculating the quantitative driving force of blister-induced delamination of diamond thin film is presented, which is on base of intensive modeling and simulation. The laser interferometer measurement with fine solution was used to pick up dynamic signals of diamond thin film bulge deformation in micrometer scale and the relationship demonstration of stress to strain of the diamond thin film was available, as a consequence, the adhesive strength could be obtained precisely and quantitatively by the valid model. The paper confirms the accessibility to precise quantitative adhesion measures of diamond films and the results will be beneficial to wide application of diamond thin films in the related fields.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
551-556
DOI
10.4028/www.scientific.net/KEM.329.551
Citation
X. G. Jian, L.D. Shi, M. Chen, F. H. Sun, "Quantitative Adhesion Measures of Diamond Films Using A Blister Test", Key Engineering Materials, Vol. 329, pp. 551-556, 2007
Online since
January 2007
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Price
$32.00
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