Paper Title:
Fabrication of Diamond Micro Tool Array (DMTA) for Ultra-Precision Machining of Brittle Materials
  Abstract

A novel conditioning technique to precisely and effectively condition the nickel electroplated mono-layer coarse-grained diamond grinding wheel of 91m grain size was developed to fabricate a Diamond Micro Tool Array (DMTA) in ductile machining of brittle materials. During the fabricating process, a copper bonded diamond grinding wheels (91m grain size) dressed by ELID (electrolytic in-process dressing) was applied as a conditioner, a force transducer was used to monitor the conditioning force, and a coaxial optical distance measurement system was used to insitu monitor the modified wheel surface status. The experimental result indicates that the newly developed conditioning technique is applicable and feasible to generate required wheel topography of less than 2μm run-out error and grain geometries. The taper cutting test on BK7 proves the fabricated DMTA is capable of realizing ductile machining of brittle materials.

  Info
Periodical
Edited by
Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki
Pages
737-742
DOI
10.4028/www.scientific.net/KEM.329.737
Citation
Q. L. Zhao, D. G. Xie, E. Brinksmeier, O. Riemer, K. Rickens, "Fabrication of Diamond Micro Tool Array (DMTA) for Ultra-Precision Machining of Brittle Materials", Key Engineering Materials, Vol. 329, pp. 737-742, 2007
Online since
January 2007
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$32.00
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