Paper Title:
Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management
  Abstract

A description is given of a possible solution of an important practical problem in microelectronics, namely producing a material of thermal expansion coeffiecient to equal that of silicon.

  Info
Periodical
Key Engineering Materials (Volumes 334-335)
Edited by
J.K. Kim, D.Z. Wo, L.M. Zhou, H.T. Huang, K.T. Lau and M. Wang
Pages
1017-1020
DOI
10.4028/www.scientific.net/KEM.334-335.1017
Citation
A. Kelly, "Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management", Key Engineering Materials, Vols. 334-335, pp. 1017-1020, 2007
Online since
March 2007
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Price
$32.00
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