Paper Title:
Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 334-335)
Edited by
J.K. Kim, D.Z. Wo, L.M. Zhou, H.T. Huang, K.T. Lau and M. Wang
Pages
385-388
DOI
10.4028/www.scientific.net/KEM.334-335.385
Citation
Y. T. Park, T. M. Kang, "Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process", Key Engineering Materials, Vols. 334-335, pp. 385-388, 2007
Online since
March 2007
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Price
$32.00
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