Paper Title:
Interformational Exfoliation of Ti3Al2 Induced by Cu
  Abstract

An interformational exfoliation behavior of the layered Ti3AlC2 induced by copper was firstly investigated via a “Cu-Ti3AlC2-Cu” sandwich sample infiltration-sintered at 1100oC to 1200oC. It was found that the molten Cu accelerates Ti3AlC2 to decompose, induces the interformational exfoliation to generate, and consequently forming a sub-micro-layered structure making up of TiC0.67 layers and Cu-Al alloy layers within a Ti3AlC2 grain. This interformational exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al the entering of Cu.

  Info
Periodical
Key Engineering Materials (Volumes 336-338)
Edited by
Wei Pan and Jianghong Gong
Pages
1371-1373
DOI
10.4028/www.scientific.net/KEM.336-338.1371
Citation
M. X. Ai, H. X. Zhai, Z. Y. Tang, "Interformational Exfoliation of Ti3Al2 Induced by Cu", Key Engineering Materials, Vols. 336-338, pp. 1371-1373, 2007
Online since
April 2007
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Price
$32.00
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