Paper Title:
Adhesion of Diamond Film to Co- Deficient Cemented Tungsten Carbide Substrate
  Abstract

Diamond film was synthesized on Co-deficient (Co content is about 0.5%) WC-Co substrate using microwave plasma chemical vapor deposition (MPCVD) equipment without special pretreatment. SEM, XRD, Rockwell-indentation test and scratch test were used to analyze the structure and morphology of the diamond film and its adhesion to the substrate. Co content was also measured by EDAX. The results show that the film synthesized is of ideal diamond structure with perfect and uniform grains, dense and continuous surface and strong adhesion. Co content on the surface of the substrate is about 0.8% after 20h deposition, which is considered as one of the main causes to get good adhesion.

  Info
Periodical
Key Engineering Materials (Volumes 336-338)
Edited by
Wei Pan and Jianghong Gong
Pages
1728-1730
DOI
10.4028/www.scientific.net/KEM.336-338.1728
Citation
H. L. Li, L. Gou, J. G. Ran, "Adhesion of Diamond Film to Co- Deficient Cemented Tungsten Carbide Substrate", Key Engineering Materials, Vols. 336-338, pp. 1728-1730, 2007
Online since
April 2007
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Price
$32.00
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