Paper Title:
Structuration and Fabrication of Sensors Based on LTCC (Low Temperature Co-Fired Ceramic) Technology
  Abstract

The purpose of this paper is to demonstrate sensors and structures fabricated using the LTCC technology, which has been addressed and employed increasingly as a smart packaging approach for several applications. The focus will be on inclination and cantilever force sensors and micro-fluidic structures. Motivation for selection of LTCC for these applications in addition to fabrication and structuring of the devices will be explained in details. TGA (thermo-gravimetric analysis), dilatometer analysis, SEM (scanning electron microscopy), electronic equipment for measuring sensor performance will be extensively used for explanation of the results. It will also be shown that, compared to classical thick-film technology on alumina, LTCC allows a considerable increase in sensitivity, and is therefore better suited for the sensing of minute forces and pressures.

  Info
Periodical
Key Engineering Materials (Volumes 336-338)
Edited by
Wei Pan and Jianghong Gong
Pages
1849-1852
DOI
10.4028/www.scientific.net/KEM.336-338.1849
Citation
H. Birol, T. Maeder, C. Jacq, G. Corradini, M. Boers, S. Straessler, P. Ryser, "Structuration and Fabrication of Sensors Based on LTCC (Low Temperature Co-Fired Ceramic) Technology", Key Engineering Materials, Vols. 336-338, pp. 1849-1852, 2007
Online since
April 2007
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Price
$32.00
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