Crack Healing, Reopening and Thermal Expansion Behavior of Al2TiO5 Ceramics at High Temperature |
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| Journal | Key Engineering Materials (Volumes 336 - 338) |
|---|---|
| Volume | High-Performance Ceramics IV |
| Edited by | Wei Pan and Jianghong Gong |
| Pages | 2448-2450 |
| DOI | 10.4028/www.scientific.net/KEM.336-338.2448 |
| Citation | Ik Jin Kim et al., 2007, Key Engineering Materials, 336-338, 2448 |
| Online since | April, 2007 |
| Authors | Ik Jin Kim, Kee Sung Lee, Christos G. Aneziris |
| Keywords | Al2TiO5, Anisotropy, Healing, Low Thermal Expansion, Microcrack, ZrTiO4 |
| Abstract | The low thermal expansion (α25-1100oC = 0.05 ~ 1.6 × 10–6/K) of Al2TiO5 ceramics are apparently due to a combination of grain boundary micro cracking caused by the large thermal expansion anisotropy of the crystal axes of the Al2TiO5 phase. During the reheating run, the individual crystallites expanded at low temperature; thus, the solid volume of the specimen expanded into the micro cracks, where as the macroscopic dimensions remained almost unchanged. As a result, the material expanded very little. The micro cracks closed at higher temperatures. This result is closely related to relatively steeper thermal expansion curves. |
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