Processing of sealing materials is a key technology in planar SOFC. In this paper, compositions of sealing materials were determined and then mixed and milled for 7~8 h. Glass materials were obtained by melt at 1300 ~ 1600°C and quenched in cold water. The powder materials were made by milling and screening. Properties of thermal expansion of sealing materials were on the same level to both electrolyte and interconnect. Experiments using 7 kinds of materials were carried respectively at 900°C and 1300°C. The most suitable sealing temperatures related to sealing materials were then determined. Thermal cycle experiments were carried and hermetical properties were tested by red-absorption. Microstructure were observed with SEM and it revealed that the prepared sealing materials joins well with YSZ but not so good with metal.