Paper Title:
Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers
  Abstract

This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.

  Info
Periodical
Edited by
Shen Dong and Yingxue Yao
Pages
263-268
DOI
10.4028/www.scientific.net/KEM.339.263
Citation
Y.S. Lu, Y. Tani, K. Soutome, Y. Kamimura, "Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers", Key Engineering Materials, Vol. 339, pp. 263-268, 2007
Online since
May 2007
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