Paper Title:
Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading
  Abstract

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.

  Info
Periodical
Edited by
Shen Dong and Yingxue Yao
Pages
276-280
DOI
10.4028/www.scientific.net/KEM.339.276
Citation
Y.T. Yu, W. Z. Yuan, D.Y. Qiao, "Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading", Key Engineering Materials, Vol. 339, pp. 276-280, 2007
Online since
May 2007
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Price
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