Paper Title
Page
Authors: Pei Jing Shi, Bin Shi Xu, Yi Xu, Q. Liu
Abstract:A special kind of surface modified copper nanoparticles was selected as the auto-reconditioning materials to in situ generate a copperized...
223
Authors: Yong Da Yan, Tao Sun, Shen Dong, Ying Chun Liang
Abstract:A three dimensional molecular dynamics model is employed to simulate AFM-based lithography process. To investigate effects of tip geometry,...
228
Authors: D.P. Zhao, D. Wu, K. Chen
Abstract:This paper introduces a fluidic technique based on patterned shapes of hydrophobic self-assembly monolayers (SAMs) and capillary forces to...
234
Authors: Y.G. Cui, Wei Jie Dong, C.Y. Gao, Q.Y. Zeng, Bao Yuan Sun
Abstract:This paper aims to make piezoelectric ceramic actuator self-sense its own displacement in the absence of independent sensor. It is derived...
240
Authors: L.Q. Du, C. Liu, H.J. Liu, J. Qin, N. Li, Rui Yang
Abstract:Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication...
246
Authors: K. Jia, H.H. Zhang, X.Q. Fan, X.P. Jiang, S. Liu
Abstract:In this paper, nonequilibrim molecular dynamics (NEMD) was used to simulate liquid flow in microchannels with ‘lotus effect’ coating....
252
Authors: Jun Hui Li, Lei Han, Ji An Duan, Jue Zhong
Abstract:An assembly bed on thermosonic flip chip bonding was set up, two different structures of tool tips were designed, and a series of...
257
Authors: Y.S. Lu, Yasuhiro Tani, K. Soutome, Yasushi Kamimura
Abstract:This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the...
263
Authors: Wen Jin Wang, Tai Yong Wang, Sheng Bo Fan, W.Y. Wang, G.F. Wang, W. Zhang
Abstract:For the problem of process monitoring of chip generation in CNC machining, the dynamic modeling of predicting chip formation using...
269
Authors: Y.T. Yu, Wei Zheng Yuan, D.Y. Qiao
Abstract:Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In...
276
Showing 41 to 50 of 90 Paper Titles