Paper Title:
Pattern Shifting Analyses of Micro-Structures of IC Package
  Abstract

Pattern shift is one of the main failures of micro-electronics. In this paper, the influence of plastic deformation values of micro-structures of IC packages on the pattern shift of metal lines is studied by maximum plastic strain theory using a certain 2D FEM model with different design parameters, “d”, “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al”. For different critical process step, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of plastic strains is established using any two design parameters. Results show that “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al” will have different influence on pattern shifting while “d” have little impact.

  Info
Periodical
Key Engineering Materials (Volumes 340-341)
Edited by
N. Ohno and T. Uehara
Pages
1333-1338
DOI
10.4028/www.scientific.net/KEM.340-341.1333
Citation
Y. T. He, R. Shi, H. P. Li, F. Li, G.Q. Zhang, L.J. Ernst, "Pattern Shifting Analyses of Micro-Structures of IC Package", Key Engineering Materials, Vols. 340-341, pp. 1333-1338, 2007
Online since
June 2007
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Price
$32.00
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