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Nanoindentation-Induced Collective Dislocation Behavior and Nanoplasticity

Journal Key Engineering Materials (Volumes 340 - 341)
Volume Engineering Plasticity and Its Applications
Edited by N. Ohno and T. Uehara
Pages 39-48
DOI 10.4028/www.scientific.net/KEM.340-341.39
Online since June, 2007
Authors Yoji Shibutani, Tomohito Tsuru
Keywords Copper (Cu), Dislocation Emission, Displacement Burst, Nanoindentation, Nanoplasticity, Prismatic Dislocation Loop, Single Crystalline Aluminium
Abstract The present paper summarizes the crystallographic dependence of the displacement burst behavior observed in nanoindentation using two single crystalline aluminum (Al) materials and copper (Cu) with three kinds of surface indices, namely (001), (110) and (111). From the critical indent load at the first burst, the critical resolved shear stresses (CRSSs) of the collective dislocation nucleation were estimated in reference to molecular dynamics (MD) simulations. These are almost one-tenth of the shear modulus, which are close to the ideal values. We explain the nanoplastic mechanics by a comprehensive energy balance model to describe the linear relation between the indent load and the burst width of the first displacement burst and by the nucleation model consisting of three-dimensional discrete dislocations to evaluate the number of dislocations nucleating. The distance between the emitted dislocation loops of Al is found to be fairly large. Thus, Al is expected to exhibit a less tangled network of dislocations just below the indentation than Cu, which has a lower stacking fault energy.
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