The mechanical and electrical applications of fine wires (D = 0.1 mm) has become more widely spread. In general, it is well known that fine drawn wires have high tensile strength while maintaining ductility. It has been determined that a hardened layer of around 0.04 mm in depth, referred to as the “additional shear strain layer,” is generated beneath the surface layer of the wire, and this additional shear strain layer affected the tensile strength of the fine wire. As an origin of this phenomenon, it was ascertained that the microstructure of surface layer was finer than that of center layer. The purpose of this paper is to investigate the effect of die angle on the microstructure and the tensile strength of the additional shear strain layer. The tensile test was performed as the surface layer was thinned by electro-polishing, and the crystal orientation and the crystal grain were measured via EBSD. As a result, it was ascertained that die angle affected the tensile strength and crystal grain refinement of the additional shear stray layer.