Paper Title:
Molecular Dynamics Analysis for Deformation and Fracture Behavior of Copper Thin Films
  Abstract

Molecular dynamics simulation is conducted to investigate the effect of notch depth on the deformation and fracture behavior of a single crystal copper which is expected to a conductive material of micro-devices. In the stress – strain relationship, a normal stress increases with increasing applied strain. Then, the normal stress decreases rapidly. When the stress decreases, the dislocation emits from a notch root and the stacking fault is formed on the {111} plane, which is slip plane of the fcc crystalline structure. The maximum stress decreases with notch depth. The non-damaging defect size is quite small. The shear stress in the slip direction at dislocation emission is constant irrespective of the notch depth. The criterion of the dislocation emission is given by the critical value of the resolved shear stress in the sliding direction.

  Info
Periodical
Key Engineering Materials (Volumes 340-341)
Edited by
N. Ohno and T. Uehara
Pages
979-984
DOI
10.4028/www.scientific.net/KEM.340-341.979
Citation
T. Fujii, Y. Akiniwa, "Molecular Dynamics Analysis for Deformation and Fracture Behavior of Copper Thin Films", Key Engineering Materials, Vols. 340-341, pp. 979-984, 2007
Online since
June 2007
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Price
$32.00
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