Paper Title:
Modelling Intergranular Stress Corrosion Cracking in Simulated Three-Dimensional Microstructures
  Abstract

Microstructure can have a significant effect on the resistance to intergranular stress corrosion cracking. Certain grain boundaries are susceptible to corrosion while others have high resistance and may form crack bridging ligaments as the crack deviates around them. To investigate the mechanics of crack bridging, 3D computational model has been previously developed. An extension to the model, to include stress corrosion crack growth kinetics is presented in this paper. An analysis of the effects of resistant grain boundary fraction demonstrates that the bridging ligaments can significantly retard short crack propagation rates. Increasing the fraction of resistant boundaries is shown to improve microstructure resistance by reducing the crack propagation rate.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
1019-1022
DOI
10.4028/www.scientific.net/KEM.345-346.1019
Citation
A. P. Jivkov, N.P.C. Stevens, T.J. Marrow, "Modelling Intergranular Stress Corrosion Cracking in Simulated Three-Dimensional Microstructures ", Key Engineering Materials, Vols. 345-346, pp. 1019-1022, 2007
Online since
August 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hiroyuki Kokawa, Masahiko Shimada, Zhan Jie Wang, Yutaka S. Sato, M. Michiuchi
Abstract:Optimum parameters in the thermomechanical treatment during grain boundary engineering (GBE) were investigated for improvement of...
1005
Authors: Hiroyuki Miyamoto, K. Kuroda, Takura Mimaki
Abstract:Sensitivity to corrosion fatigue (CF) crack initiation has been investigated in a series of pure copper bicrystals with a symmetrical...
2415
Authors: Tadao Watanabe, Shigeaki Kobayashi, Xiang Zhao, Liang Zuo
Chapter 6: Materials
Abstract:Bulk properties of polycrystalline structural and functional materials are controlled by the grain boundary microstructure defined by the...
703
Authors: Shigeaki Kobayashi, Ryouta Fukasawa, Tadao Watanabe
Chapter 23: Thin Films & Interface Engineering
Abstract:The evolution of grain boundary microstructures in gold thin films during annealing was investigated in order to find a clue to the...
2880
Authors: Myrjam Winning, Dierk Raabe
Monday
Abstract:The paper introduces first investigations on how low angle grain boundaries can influence the recrystallisation behaviour of crystalline...
191