Ti and Au foils with a thickness of 10μm were formed by indenting at a place neighboring another indented place sequentially by means of a hemispherical diamond tool with a radius of 5μm. In this forming method, forming dies are not necessary and commercial equipments for nanoindentation can be used. Forming load and pitch were changed in single line forming and forming direction, line pitch and line number were changed in plural line forming, and bending angle was investigated. From the experimental results, bending angle of Ti foil was greater than that of Au one when same working conditions were employed. As the forming pitch increased, bending angle decreased. When the forming line pitch was changed, bending angle had the maximum peak at a pitch of 30μm by one-way forming path and 25μm by two-way forming path. Bending angle by one-way forming path was larger than that by two-way forming path. As forming line number increased, although bending angle increased, increment of them became smaller.