Paper Title:
Evaluation of Adhesive Strength in the Bonded Area of Shoes by Using IR Camera
  Abstract

The Infrared Camera usually detects only Infrared waves emitted from the light in order to illustrate the temperature distribution. An Infrared diagnosis system can be applied to various fields. But the defect discrimination can be automatic or mechanized in the shoes total inspection system. The thermal images of the specimens were analyzed. In shoes, weak bonding due to the separation of the bonded parts delamination causes defects. The most serious defect occurs in the bonding between the outer covering of the shoe and the sole, and to up now, this defect has been detected only by inspection with the naked eye. This study introduces a method for special shoes nondestructive total inspection. Performance of the proposed method is shown through thermo-Image. In search of superior inspection methods, we evaluated an applicable non-destructive inspection method and also carried out basic research for developing an innovative nondestructive inspection system for shoes. The total inspection system using infrared thermal camera for special shoes, its applicability, and system configuration are introduced.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
1149-1152
DOI
10.4028/www.scientific.net/KEM.345-346.1149
Citation
C. J. Choi, J. Y. Kim, S. H. Choi, "Evaluation of Adhesive Strength in the Bonded Area of Shoes by Using IR Camera", Key Engineering Materials, Vols. 345-346, pp. 1149-1152, 2007
Online since
August 2007
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Price
$32.00
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