Paper Title:
Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM
  Abstract

It is well-known that the vibration significantly affect the life of solder joint. In this paper, the effects of the vibration on the failure probability of the solder joint are studied by using the failure probability models such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM). The accuracies of the results are estimated by a help of the Monte Carlo Simulation (MCS). The reliability of the lead and the lead-free solder joint was also evaluated. The reliability of lead-free solder joint is found to be higher than that of lead solder joint.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
1393-1396
DOI
10.4028/www.scientific.net/KEM.345-346.1393
Citation
O. S. Lee, M. J. Hur, Y. C. Park, D. H. Kim, "Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM", Key Engineering Materials, Vols. 345-346, pp. 1393-1396, 2007
Online since
August 2007
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Price
$32.00
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