Paper Title:
Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials
  Abstract

Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and heat treatment process. These specimens were evaluated the formability and bonding strength of Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about 10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized crevice in reacted region of Al/STS interfaces.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
1497-1500
DOI
10.4028/www.scientific.net/KEM.345-346.1497
Citation
D. S. Bae, S. K. Kim, S. L. Lee, T. Shibayama, D. H. Bae, "Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials", Key Engineering Materials, Vols. 345-346, pp. 1497-1500, 2007
Online since
August 2007
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Price
$32.00
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