Creep Resistance of Thermoplastic Nanocomposites |
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| Journal | Key Engineering Materials (Volumes 345 - 346) |
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| Volume | The Mechanical Behavior of Materials X |
| Edited by | S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim |
| Pages | 1621-1624 |
| DOI | 10.4028/www.scientific.net/KEM.345-346.1621 |
| Citation | Alois K. Schlarb et al., 2007, Key Engineering Materials, 345-346, 1621 |
| Online since | August, 2007 |
| Authors | Alois K. Schlarb, Jing Lei Yang, Zhong Zhang |
| Keywords | Creep, Nanocomposite, Polyamide 66 |
| Abstract | Relatively poor creep resistance is considered as a deficiency of thermoplastic materials in general. In order to comprehensively and deeply study the effect of nanoparticles incorporated into a polyamide matrix a systematic investigation on various kinds of nanofillers under differed temperatures and stress levels have been performed. It was found that the creep resistance of polyamide 66 can be significantly enhanced due to the incorporation of nanofillers and the behavior of the composites can be easily described by the model of Findley. |
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