Paper Title:
Vibration Fracture Behavior of Sn-xCu Lead-Free Solders
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
477-480
DOI
10.4028/www.scientific.net/KEM.345-346.477
Citation
F. Y. Hung, T. S. Lui, L. H. Chen, N. T. He, "Vibration Fracture Behavior of Sn-xCu Lead-Free Solders", Key Engineering Materials, Vols. 345-346, pp. 477-480, 2007
Online since
August 2007
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Price
$32.00
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