Paper Title:
Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy
  Abstract

The eutectic Sn3.8Ag0.7Cu alloy is widely considered a leading Pb-free replacement for the eutectic Pb-Sn solder alloy in electronic packaging where creep deformation and rupture is a major concern. In this study, creep rupture behavior of Sn-Ag-Cu solder alloy was investigated under the isothermal condition. Creep tests were conducted under a range of stresses and temperatures. Creep lifetime data were analyzed by the combined time-temperature equations following the Sherby, Larsen-Miller, and Manson-Haferd approaches. From these analyses, a series of material parameters were obtained from the experimental data. The results showed that the Manson-Hanferd method provided a better correlation with the creep rupture data. The mechanisms of creep deformation and rupture at different time-temperature combinations are discussed.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
585-588
DOI
10.4028/www.scientific.net/KEM.345-346.585
Citation
L. Zhang, Z. G. Wang, J.K. Shang, "Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy", Key Engineering Materials, Vols. 345-346, pp. 585-588, 2007
Online since
August 2007
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Price
$32.00
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