Paper Title:
A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure
  Abstract

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
785-788
DOI
10.4028/www.scientific.net/KEM.345-346.785
Citation
H. S. Kim, Y. C. Park, S. H. Oh, S. H. Kim, Y. J. Jo, J. H. Kang, "A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure", Key Engineering Materials, Vols. 345-346, pp. 785-788, 2007
Online since
August 2007
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$32.00
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