Paper Title:
Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging
  Abstract

This paper discusses ratchetting deformation of lead-free solder Sn/3Ag/0.5Cu and lead-containing solder alloy Sn/37Pb with several stress amplitudes and stress ratios of the maximum stress to the minimum stress. First the uniaxial ratchetting testsare conducted with three maximum stresses and five stress ratios. The all tests are conducted using cylindrical bulk specimens of the solder alloys at 313 K. The test results show that there is the difference in the viscoplastic deformation behavior between two solder alloys. The relationship between ratchetting strain and time is estimated by Biley-Norton law to explain that the uniaxial ratchetting deformation is strongly dominated by the viscous deformation. Finally, the ratchetting deformation is simulated by the dislocation based constitutive model proposed by Estrin [1]. The simulations show that there is a possibility to simulate the uniaxial ratchetting by clarifying the dislocation mechanism of the solder alloys.

  Info
Periodical
Key Engineering Materials (Volumes 345-346)
Edited by
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages
97-100
DOI
10.4028/www.scientific.net/KEM.345-346.97
Citation
T. Kobayashi, K. Sasaki, K.-I. Ohguchi, Y. Narita, "Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging ", Key Engineering Materials, Vols. 345-346, pp. 97-100, 2007
Online since
August 2007
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$32.00
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