Paper Title:
Effects of Particle Size on the Thermal Physical Properties of SiCp/Al Composites
  Abstract

The coefficients of thermal expansion (CTEs) of the 20 vol% SiCp/Al composites fabricated by powder metallurgy process were measured and examined from room temperature to 450°C The SiC particles are in three nominal sizes 5μm, 20μm and 56μm. The CTEs of the SiCp/Al composites were shown to be apparently dependent on the particle size. That the larger particle size, the higher CTEs of the composites, is thought to be due to the difference in original thermal residual stresses and matrix plasticity during thermal loading. The thermal conductivity of the composites also increases with particle size increasing.

  Info
Periodical
Edited by
Di Zhang, Jingkun Guo and Chi Y. A. Tsao
Pages
131-134
DOI
10.4028/www.scientific.net/KEM.351.131
Citation
L. Geng, Y. W. Yan, "Effects of Particle Size on the Thermal Physical Properties of SiCp/Al Composites", Key Engineering Materials, Vol. 351, pp. 131-134, 2007
Online since
October 2007
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