Paper Title:
Plastic Deformation of Silicon Nitride Nano-Ceramics
  Abstract

A commercial silicon nitride powder with sintering additives was ground by high-energy milling to reduce particle size. Nanometer sized powder was obtained. The powder was densified for short time by spark plasma sintering to prevent grain growth. Nanometer-grained Si3N4 ceramics were obtained. Plastic deformation of the Si3N4 nano-ceramics has been studied in compression over a wide range of strain rates and temperatures. The experimental results revealed that a transition in stress exponent, n, at each temperature. The n value decreased from ~ 2 to ~ 1 with increasing applied stress. Activation energy was also different for the two regions, decreasing from 858.2 kJ/mol in the n ~ 2 region to 571.8 kJ/mol in the n ~ 1 region. Effect of sintering additives on plastic deformation was also discussed.

  Info
Periodical
Edited by
Katsutoshi Komeya, Yohtaro Matsuo and Takashi Goto
Pages
189-192
DOI
10.4028/www.scientific.net/KEM.352.189
Citation
T. Nishimura, X. Xu, N. Hirosaki, R. J. Xie, H. Tanaka, "Plastic Deformation of Silicon Nitride Nano-Ceramics", Key Engineering Materials, Vol. 352, pp. 189-192, 2007
Online since
August 2007
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Price
$32.00
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