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Measurement of Indentation Fracture Toughness of Silicon Nitride Ceramics: II, Effect of the Experimental Conditions

Journal Key Engineering Materials (Volume 352)
Volume Innovation in Ceramic Science and Engineering
Edited by Katsutoshi Komeya, Yohtaro Matsuo and Takashi Goto
Pages 45-48
DOI 10.4028/www.scientific.net/KEM.352.45
Citation Hiroyuki Miyazaki et al., 2007, Key Engineering Materials, 352, 45
Online since August, 2007
Authors Hiroyuki Miyazaki, Hideki Hyuga, Yuichi Yoshizawa, Kiyoshi Hirao, Tatsuki Ohji
Keywords Fracture Toughness, Indentation Fracture Technique
Abstract

The influence of two measuring conditions, the elapsed time after indentation and the condition of edge of an indenter, on the indentation fracture toughness of silicon nitrides was assessed. No slow crack-growth after unloading was confirmed by optical microscopic observation of a crack tip induced by the indentation, which led to the negligible difference in fracture toughness measured at 1 and 30 min after the indentation. Measurements with relatively new and used indenters gave almost the same fracture toughness data, indicating that the crack lengths were hardly affected by the slight damage of the corner of the indenter. It was suggested that the large scattering of the indentation fracture toughness reported by the round-robin tests such as VAMAS was not originated from these factors.

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