Interface Strength of Low-Dimensional Nano-Components
| Periodical | Key Engineering Materials (Volumes 353 - 358) |
|---|---|
| Main Theme | Progresses in Fracture and Strength of Materials and Structures |
| Edited by | Yu Zhou, Shan-Tung Tu and Xishan Xie |
| Pages | 1-8 |
| DOI | 10.4028/www.scientific.net/KEM.353-358.1 |
| Citation | Takayuki Kitamura et al., 2007, Key Engineering Materials, 353-358, 1 |
| Online since | September, 2007 |
| Authors | Takayuki Kitamura, Hiroyuki Hirakata, Yoshimasa Takahashi |
| Keywords | Delamination, Fatigue, Fracture Mechanic, Interface, Interface Crack, Interface Edge, Interface Strength, Low-Dimensional Component, Microdot, Plasticity, Thin Film |
| Price | US$ 28,- |
The interface strength of low-dimensional nano-components such as films and islands formed on substrates has been investigated in this project, and the focus is put on the mechanics of crack initiation from the free interface edge and propagation along the interface. The series of experiments elucidates the applicability of fracture mechanics concept on the structures. We proposed experimental methods for evaluating the initiation strength of an interface crack in submicron films and islands deposited on substrates. The initiation is governed by the singular stress field, and the criterion is prescribed by the stress intensity parameter. Using special loading apparatus built in a TEM, we developed a crack initiation method for nano-components and the role of plasticity on the delamination is clarified. Subcritical crack growth along an interface between submicron films under fatigue was also investigated by modified four-point bend method.
