Paper Title:
Fatigue Properties of Nanometer-Scale Copper Films
  Abstract

Fatigue tests of nanometer-thick Cu films as deposited and annealed in vacuum were conducted under constant load ranges at room temperature. Fatigue strengths of the Cu films, which is defined as the critical load range being able to cause crack initiation within 106 cycles, are determined. The experimental results show that fatigue strength increases with decreasing film thickness. Fatigue cracking behaviors were characterized by electron microscope. It is also found that fatigue cracking resistance is dependent on film thickness and increases with decreasing film thickness. Size effects on fatigue properties of the nanometer-thick Cu films are discussed.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
116-119
DOI
10.4028/www.scientific.net/KEM.353-358.116
Citation
B. Zhang, K.H. Sun, J. Gong, C. Sun, Z. G. Wang, G.P. Zhang, "Fatigue Properties of Nanometer-Scale Copper Films", Key Engineering Materials, Vols. 353-358, pp. 116-119, 2007
Online since
September 2007
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Price
$35.00
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