Paper Title:
Mechanical Properties of SiCp/Cu Composites Prepared by Electric Conduction Sintering
  Abstract

SiCp/Cu composites were fabricated at 700 oC and under 40MPa for 10min in vacuum by electric conduction sintering. The mechanical properties and microstructure of the composites were studied. The porosity of the composites increases when the volume fraction of SiCp exceeds 35%. The flexural strength of the composites decreases with increasing fraction of SiCp. The composites with 10 vol.% SiCp exhibited ductile fracture behavior, while composites with the volume fraction of SiCp in the range of 20–65% exhibited brittle fracture behavior. The composites with 35 vol.% SiCp showed the highest hardness.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
1402-1405
DOI
10.4028/www.scientific.net/KEM.353-358.1402
Citation
C. H. Wang, S. K. Guan, S. S. Li, R. Zhang, "Mechanical Properties of SiCp/Cu Composites Prepared by Electric Conduction Sintering", Key Engineering Materials, Vols. 353-358, pp. 1402-1405, 2007
Online since
September 2007
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$32.00
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