Paper Title:
Development of Cu Brazing Sheet with Cu-P Composite Plating
  Abstract

A Cu brazing sheet has been developed using a Cu-P composite plating method. A Cu-P composite plating layer, which contains 7mass%P, was formed on a Cu plate with a copper sulfate solution including P particles. The melting start temperature of the Cu-P composite layer was determined to be approximately 765°C. Microstructure and joint strength of a brazed joint with the Cu-P composite layer were investigated and compared with those of the joint with a conventional Cu-7P filler foil. As the results of the study, it was clarified that the Cu-P composite layer developed is feasible to use as a brazing material for Cu and Cu alloys.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2025-2028
DOI
10.4028/www.scientific.net/KEM.353-358.2025
Citation
I. Shohji, S. Arai, N. Kano, N. Otomo, M. Uenishi, "Development of Cu Brazing Sheet with Cu-P Composite Plating", Key Engineering Materials, Vols. 353-358, pp. 2025-2028, 2007
Online since
September 2007
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Price
$32.00
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