Paper Title:
Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge
  Abstract

An influence of content of Ni and Ag in a Sn-Ag-Cu-Ni-Ge lead-free solder has been investigated on microstructure and joint strength of the soldered joint under heat exposure conditions. The growth kinetics of the reaction layer formed at the joint interface has been investigated, and the apparent activation energy of the reaction layer growth has been also examined. Moreover, the soldered joints with Sn-Ag and Sn-Ag-Cu solders were prepared and were compared with the joints with the Sn-Ag-Cu-Ni-Ge solders.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2033-2036
DOI
10.4028/www.scientific.net/KEM.353-358.2033
Citation
I. Shohji, S. Tsunoda, H. Watanabe, T. Asai, "Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge", Key Engineering Materials, Vols. 353-358, pp. 2033-2036, 2007
Online since
September 2007
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Price
$32.00
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