Paper Title:
Crack Growth Characteristics of Pure Copper for Smart Stress Memory Patch
  Abstract

A new sensing method called “smart stress memory patch”, which could estimate the maximum stress, the stress amplitude and the fatigue cyclic number simultaneously using Kaiser effect of Acoustic Emission (AE) and crack length of this patch, was developed. In this study, the crack growth characteristics of this patch was evaluated. Pure copper was used for this patch because its good corrosion resistance, stable crack propagation and so on. Two kinds of samples which were rolled and electrodeposited copper were prepared to investigate the effect of microstructure on crack growth behavior. Fatigue test was performed under constant stress amplitude to evaluate the crack growth behavior using the relationship between stress intensity factor range and crack propagation rate. The scattering in fatigue crack growth was also investigated to obtain the relationship between crack length and the fatigue cyclic number including two-sided 95% confidence interval. The effect of thickness and grain size on the scattering was discussed. Finally, good crack growth behavior was obtained and the fatigue cyclic number could be estimated by this patch.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2045-2048
DOI
10.4028/www.scientific.net/KEM.353-358.2045
Citation
S. Nambu, M. Enoki, "Crack Growth Characteristics of Pure Copper for Smart Stress Memory Patch", Key Engineering Materials, Vols. 353-358, pp. 2045-2048, 2007
Online since
September 2007
Export
Price
$32.00
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