Paper Title:
Comparison of Reliability of Solder Joints by FORM and SORM
  Abstract

The difference in the Coefficient of Thermal Expansion (CTE) between the chip and the substrate generate thermal displacement in the solder joint. It seems to be a main cause of failure in the solder joint when the chip and the substrate are heated repeatedly. The failure of the solder joints by thermal fatigue is known to be influenced by varying boundary conditions such as the difference in CTE, the height of solder, the Distance of the solder joint from the Neutral Point (DNP) and the temperature variation. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM).

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2593-2596
DOI
10.4028/www.scientific.net/KEM.353-358.2593
Citation
O. S. Lee, M. J. Hur, Y. C. Park, D. H. Kim, "Comparison of Reliability of Solder Joints by FORM and SORM", Key Engineering Materials, Vols. 353-358, pp. 2593-2596, 2007
Online since
September 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Bong Suk Kim, Soo Hun Lee, Jong Soo Kim, Jun Yeob Song
Abstract:The importance of evaluation and establishment during product development process, for the reliability and safety of mechanical system and...
1535
Authors: Yan Gang Zhao, Yue Feng Geng, Kazuhiro Yoshihara
Abstract:In ultimate asseismic design of ductile frame structures, plastic deformation and plastic hinge are generally permitted, and some preferred...
1393
Authors: Zhen Qing Wang, Song Zhou, Ji Feng Zhang, Xiao Qiang Wang
Abstract:Composite materials have excellent mechanical properties and can be mechanically tailor designed, so the composite materials are widely used...
742