Paper Title:
Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element
  Abstract

In this paper, a speckle microinterferometric system was employed to study the thermal deformation of the Cu microbridges with different dimensions. The deflections of the microbridges caused by the thermal loading were measured with real-time by the speckle microinterferometric system and the surface temperatures of the bridges were recorded using a digital thermometer. The deformation evaluation after microbridges buckling was also recorded with our testing system. Then, the experimental results were compared with the finite element analysis (FEA).

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2871-2874
DOI
10.4028/www.scientific.net/KEM.353-358.2871
Citation
Z. Zhang, X. D. Li, W. Shen, "Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element", Key Engineering Materials, Vols. 353-358, pp. 2871-2874, 2007
Online since
September 2007
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Price
$32.00
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