Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element |
|
| Journal | Key Engineering Materials (Volumes 353 - 358) |
|---|---|
| Volume | Progresses in Fracture and Strength of Materials and Structures |
| Edited by | Yu Zhou, Shan-Tung Tu and Xishan Xie |
| Pages | 2871-2874 |
| DOI | 10.4028/www.scientific.net/KEM.353-358.2871 |
| Citation | Zhao Zhang et al., 2007, Key Engineering Materials, 353-358, 2871 |
| Online since | September, 2007 |
| Authors | Zhao Zhang, Xi De Li, Wen Shen |
| Keywords | Microbridge, Speckle Interferometry, Thermal Deformation |
| Abstract | In this paper, a speckle microinterferometric system was employed to study the thermal deformation of the Cu microbridges with different dimensions. The deflections of the microbridges caused by the thermal loading were measured with real-time by the speckle microinterferometric system and the surface temperatures of the bridges were recorded using a digital thermometer. The deformation evaluation after microbridges buckling was also recorded with our testing system. Then, the experimental results were compared with the finite element analysis (FEA). |
| Full Paper | 
Get the full paper by clicking here
|
First page example
