Paper Title:
The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test
  Abstract

The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate the reliability of the specimens bonded with ACFs. It was found that the high temperature/humidity was the harshest condition to the ACFs bonding. The DSC testing and interfacial stresses analysis has been done under the high temperature/humidity condition. The mechanisms of the bonding strength decrease were investigated.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2875-2878
DOI
10.4028/www.scientific.net/KEM.353-358.2875
Citation
J. Zhang, X. Chen, X. L. Wei, Y. C. Lin, "The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test", Key Engineering Materials, Vols. 353-358, pp. 2875-2878, 2007
Online since
September 2007
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