Paper Title:
Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology
  Abstract

Creep property of solder alloys is one of the important factors to effect the reliability of surface mount technology (SMT) soldered joints. The creep behavior and its rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and predicted under constant temperature by a single shear lap creep specimen with a 1mm2 cross sectional area and finite element method (FEM) in this paper. Results show that the creep property of Sn2.5Ag0.7Cu0.1RE is superior to that of the commercial employed lead-free solder Sn3.8Ag0.7Cu and the creep rupture life of its soldered joints is 8.4 times more than that of Sn2.5Ag0.7Cu solder. The creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints indirectly predicted by FEM is better in accord with that of actual testing results, which are important to design the reliability of lead-free soldered joints for SMT.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2912-2915
DOI
10.4028/www.scientific.net/KEM.353-358.2912
Citation
K. K. Zhang, Y. L. Wang, Y. L. Fan, J. Yiang, Y. F. Yan, X. Zhang, "Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology", Key Engineering Materials, Vols. 353-358, pp. 2912-2915, 2007
Online since
September 2007
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Price
$32.00
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