Paper Title:
Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions
  Abstract

The long-term hygrothermal aging will induce the irreversible damages of epoxy-based anisotropic conductive film (ACF) joints. In this study, hygrothermal environment tests were used to accelerate the degradation of ACF joints in Chip-on-Glass (COG) assemblies. The effects of aging on adhesion strengths were measured by shear mode tests and changes of molecular conformation of ACF material were analyzed by Fourier Transform Infrared Spectroscopy (FTIR). Also, the fracture surfaces of ACF joints were investigated by Scanning Electronic Microscope (SEM). The results show that the ACF adhesion strengths decrease with aging; some chemical modifications occur in the aged ACF joints; the fracture failure mechanisms change with the hygrothermal aging.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2936-2939
DOI
10.4028/www.scientific.net/KEM.353-358.2936
Citation
Y. C. Lin, X. Chen, J. Zhang, "Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions", Key Engineering Materials, Vols. 353-358, pp. 2936-2939, 2007
Online since
September 2007
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Price
$32.00
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