Paper Title:
Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue
  Abstract

This paper studies the crack propagation at Sn37Pb-copper interface in push-pull low cycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distances from the interface were fatigued at 313K and the crack propagation paths were observed. Cracks propagated at the interface when the notch hole was near the interface but propagated in the solder when the notch hole was away from the interface. The propagation rate of the interfacial crack was faster than that of non-interface crack. The crack path and crack propagation rate of the two types of cracks were discussed in relation to J integral range calculated by finite element method.

  Info
Periodical
Key Engineering Materials (Volumes 353-358)
Edited by
Yu Zhou, Shan-Tung Tu and Xishan Xie
Pages
2962-2965
DOI
10.4028/www.scientific.net/KEM.353-358.2962
Citation
M. Sakane, K. Itoh, Y. Tsukada, K. Terada, "Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue", Key Engineering Materials, Vols. 353-358, pp. 2962-2965, 2007
Online since
September 2007
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Price
$32.00
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