The strengthening effects of the Cu-80 wt.% W (CuW80) alloy and the copper parts in Cu-80wt.% W /Cu (CuW80/Cu) solid contact alloy, which was sintered and infiltrated prepared by powder metallurgy, were investigated. The effects of different compressive deformation on microstructure and properties of the CuW80 were studied. Furthermore, the influences of HextrusionH on copper parts, the carrier material of the solid contact alloy CuW80/Cu were also investigated. The results show that the tungsten and copper phases are closely bonded by physical bond in the form of pseudo-alloy and the copper phase is homogeneously dispersed within the tungsten framework. The hardness of the CuW80 increases with increasing compressive deformation. Especially, the hardness of the copper parts in CuW80/Cu increases remarkably after extrusion and the maximum value can reach 200%. The hardness increases from the inner to the surface and is proportional to the distance departing from the interface of the CuW80 and Cu. TEM observation shows that the dislocation tangles exist, even inside the dislocation cell, in copper grains after extrusion.