Paper Title
Page
Authors: Jun Zhang, Xu Chen, Xin Li Wei, Yong Cheng Lin
Abstract:The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate...
2875
Authors: Qing Hua Li, Jian Hua Zhang
Abstract:Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as...
2879
Authors: Guo Qin Chen, Gao Hui Wu, Long Tao Jiang, De Zhi Zhu, Dong Li Sun
Abstract:Microstructure and mechanical properties of the 55%, 60% and 67% Mo/Cu composites for electronic packaging application fabricated by a...
2883
Authors: Zi Yang Xiu, Gao Hui Wu, De Zhi Zhu
Abstract:Sip/4032Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting...
2887
Authors: Hong Peng Li, Yu Ting He, Rong Shi, Heng Xi Zhang, Feng Li
Abstract:The mostly working time of airborne electronic equipment is under preliminary depletion failure phase, and inspection & maintenance at...
2892
Authors: Yu Ting He, Hong Peng Li, Feng Li, Chao Hua Fan
Abstract:Based on the analyses of reliability and life characteristics in electronic equipment, a new concept of Electronic Equipment Life Envelope...
2896
Authors: Hong Peng Li, Rong Shi, Yu Ting He, Heng Xi Zhang, Feng Li
Abstract:Passivation cracking is one of the main failures of Integrated circuits (ICs). A major cause for these failures is due to the mismatch of...
2900
Authors: Kuo Jun Xie, Chang Shun Jiang, Lin Zhu, Hai Feng Xu
Abstract:With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and...
2904
Authors: Ning Bai, Xu Chen, Xin Li
Abstract:A series of torsional fatigue tests were conducted on 63Sn-37Pb and Sn-0.7Cu solders. A continuous load drop was observed during the test....
2908
Authors: Ke Ke Zhang, Yao Li Wang, Yan Li Fan, Jie Yiang, Yan Fu Yan, Xin Zhang
Abstract:Creep property of solder alloys is one of the important factors to effect the reliability of surface mount technology (SMT) soldered joints....
2912
Showing 691 to 700 of 754 Paper Titles