Paper Title
Page
Authors: G.P. Zhang, Bin Zhang, Q.Y. Yu, J. Tan
Abstract:An in-situ testing system for thermal-mechanical fatigue of thin metal lines was setup inside a dual-beam focused ion beam (FIB)/scanning...
2916
Authors: Ke Jia Li, Xia Xiao, Yu Feng Jin
Abstract:Porous silicon dioxide films featuring low dielectric constant are of great scientific and commercial interest because of their outstanding...
2920
Authors: Yu Feng Jin, Hao Tang, Zhen Feng Wang
Abstract:Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perform their basic functions properly and to...
2924
Authors: Xiao Yan Li, Xiao Hua Yang, Wei Zhen Dui, Ben Sheng Wu
Abstract:The formation and evolution of the intermetallic compound (IMCs) between SnAgCu lead-free solder and Cu substrate, after isothermal aging at...
2928
Authors: Yong Cheng Lin, Xu Chen, Xing Shen Liu, Guo Quan Lu
Abstract:The reliability of solder joints in flip chip assemblies with both compliant (flex) and rigid (PCB) substrates was studied by accelerated...
2932
Authors: Yong Cheng Lin, Xu Chen, Jun Zhang
Abstract:The long-term hygrothermal aging will induce the irreversible damages of epoxy-based anisotropic conductive film (ACF) joints. In this...
2936
Authors: Xu Chen, Shu Feng Zhao, Linda Zhai
Abstract:Structural model of plastic electronic package under temperature and humidity is constructed, and the coupling of the thermal and moisture...
2940
Authors: Yan Hong Tian, Chun Qing Wang
Abstract:Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concern in area array electronics packaging technology. In...
2944
Authors: Thomas G. Lei, Jesus Calata, Shu Fang Luo, Guo Quan Lu, Xu Chen
Abstract:Today, reflow soldering is a commonly used technique to establish large-area joints in power electronics modules. These joints are needed to...
2948
Authors: Hideo Miura, Kazuhiko Sakutani, Kinji Tamakawa
Abstract:The mechanical properties of copper thin films deposited by sputtering and electroplating were compared using tensile test and...
2954
Showing 701 to 710 of 754 Paper Titles