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Advances in Grinding and Abrasive Technology XIV

Volumes 359 - 360
doi: 10.4028/www.scientific.net/KEM.359-360
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Preface

Mechanism of Brittle-Ductile Transition of Single Silicon Wafer at Different Temperatures

Authors: Yu Li Sun, Dun Wen Zuo, Yong Wei Zhu, Duo Sheng Li, Mei Qi, Min Wang

1

Mechanism of Material Removal and the Generation of Defects by MD Analysis in Three-Dimensional Simulation in Abrasive Processes

Authors: Jia Xuan Chen, Ying Chun Liang, Qing Shun Bai, Yu Lan Tang, Ming Jun Chen

6

Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength

Authors: Jian Bing Zang, Jing Lu, Yan Hui Wang, Xiang Hong Zhang, Yun Gang Yuan

11

Effect of Si and Ti Coating on Interface Bonding between Diamond and Fe-Based Metal Bond

Authors: Jing Lu, Yan Hui Wang, Jian Bing Zang, Shu Xian Shan

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Nanodiamond Modified with SHP

Authors: Yong Wei Zhu, Feng Xu, Jian Liang Shen, Bai Chun Wang, Xiang Yang Xu

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Study on Tribological Performance of Fine-Grained Diamond Films

Authors: Bin Shen, Wei Zuo, Fang Hong Sun, Ming Chen

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The Experimental Study on Wear Performance of Brazed Diamond Grits

Authors: Yan Chen, Hong Jun Xu, Yu Can Fu

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Grinding Titanium Alloy with Brazed Monolayer CBN Wheels

Authors: Chang Yong Yang, Jiu Hua Xu, Wen Feng Ding, Sheng Ting Tong

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High Performance Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels

Authors: Shu Sheng Li, Jiu Hua Xu, Bing Xiao, Yu Can Fu, Hong Jun Xu

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