Paper Title:
Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength
  Abstract

The adhesion between diamond grits and the bond strongly influence the properties of diamond tools. Since diamond is covalent crystal, the high interfacial energy leads to the poor interface bonding between diamond grits and the bond. Furthermore, the sintering temperature of traditional vitrified bond is also very high because of the high refractoriness of alkalis containing in the bond, resulting in serious thermal damage to diamond grits. In this paper, a low melting point and high strength vitrified bond has been prepared mainly from borate glass, clay and lead glass. The bond is completely glassy above 850°C and the bending strength of the bond sintered at 850°C for 7 minutes is 125.7MPa with a 6.5:3.5 corundum/bond ratio. Moreover, this bond possesses good wettability with diamond abrasive from 600°C to 850°C.

  Info
Periodical
Key Engineering Materials (Volumes 359-360)
Edited by
Jiuhua Xu, Xipeng Xu, Guangqi Cai and Renke Kang
Pages
11-14
DOI
10.4028/www.scientific.net/KEM.359-360.11
Citation
J. B. Zang, J. Lu, Y. H. Wang, X. H. Zhang, Y. G. Yuan, "Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength ", Key Engineering Materials, Vols. 359-360, pp. 11-14, 2008
Online since
November 2007
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$32.00
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